Model PF-2400: Controlled Atmosphere Large Format Vacuum Furnace
FOR HIGH VOLUME PRODUCTION IN VACUUM AND INERT GAS ENVIRONMENTS
The PF-2400 is ideally suited for processes requiring close control of both temperature
and atmosphere. Primarily intended for void-free, flux-free soldering, the PF-2400
is capable of operating at 10 millitorr vacuum levels, or at pressures as high as
50 psig using inert gasses. Temperature is controlled in increments of 1°C from
ambient up to a maximum operating temperature of 500°C.
Features and Benefits:
- Windows based control system
- Infrared Sensor Package Sealing
- Void-free, flux-free soldering
- Low cost of operation
Typical Applications:
- Automotive diode assembly
- High power eutectic die attachment
- BGA and wafer solder sphere reflow
- High volume component assembly
Process Chamber
The process chamber for the PF-2400 is a stainless steel ASME certified pressure
vessel. It has an inner and outer wall to accommodate water cooling. Rectangular
in shape, with an automated lid sealing system and hermetically sealed feedthroughs,
the chamber is capable of operating at pressures from 10 millitorr to 50 psig.
An array of upper and lower gas rakes are positioned inside the chamber to create
turbulent flow directly over process boats and underneath the graphite platens.
Process gas or air is selected from one of the three gas inputs, along with a programmed
flow rate. This system is designed to cool the product quickly to handling temperature.
Three graphite platens arranged edge to edge constitute a single heating zone. Heating
is primarily achieved via conduction from the platens into graphite fixtures holding
the components. Free-floating weights may be used to apply sealing force to insure
reliable solder attachment.
Control System
The PF-2400 is controlled through a distributed logic system that links intelligent
temperature and pressure controller to a Windows® based central controller. All
process parameters are controlled automatically with programs developed for each
application.
The operator interface features a colorgraphic display with menu-driven soft keys.
For process engineers and maintenance personnel a standard PC type alphanumeric
keyboard may be connected for programming and maintenance functions. All operational
recipes and profiles can be recorded directly on the system hard drive for future
use, if desired. The system includes an RS-232/422 port for external control, host
communication/Ethernet and a separate parallel port for printer output.
If Internet access is available, troubleshooting, diagnoses, maintenance and upgrades
can all be performed from our manufacturing facility to anywhere in the world!
Model 3130: Programmable Vacuum / Pressure Furnace
FOR HIGH RELIABILITY MICROELECTRONIC PACKAGE ASSEMBLY
The 3130 is a programmable vacuum and pressure furnace offered by SST International
for high reliability microelectronic package assembly. Advanced technology, provided
by the system, allows users to create void-free solder joints without the use of
flux. The 3130 is used in both production and research environments.
The system provides precise automatic control of heating and cooling up to 500 °C
(1000 °C optional) in an inert gas environment from vacuum levels of below 50 millitorr
to pressures exceeding 50 psig. Machine control is provided by an embedded control
system operating in a Microsoft Windows® environment. An unlimited number of process
profiles can easily be created and stored in the controller. Run data is archived
for quality control and off-line data analysis. Internet and intranet network connectivity
is available as an option, permitting remote monitoring, troubleshooting and maintenance
capabilities. Custom-designed resistive graphite heating fixtures (ordered separately)
are matched to user application requirements for optimum system performance.
Control System
The 3130 utilizes a distributed logic system that links intelligent temperature
and pressure controllers to a Windows® based central control. All process parameters
are controlled automatically with user-edited programs for each application. Multiple
temperature and pressure ramps and dwells are easily programmed as time-based events.
Vacuum levels, gas pressures and flow rates are independently programmable. Furnace
operating characteristics are continuously monitored and the operator is alerted
to any unusual conditions. The operator interface features a color touch-screen
display. For process engineers and maintenance personnel a standard computer keyboard
with trackball is provided behind a locking front panel. All process profiles are
stored directly on the system hard drive.